Product introduction
Our 8 ounce heavy copper PCB is designed to meet the demands of high-power applications that require rapid heat dissipation, such as power supplies, motor control, and voltage regulators. With our unique technology, we are able to overcome the challenges of using a thick copper plate solder printing method, thereby saving a lot of solder mask ink and reducing costs while improving production efficiency.
The thicker copper layer of our PCB provides additional features such as higher power distribution capacity and better thermal management, which makes it superior to conventional PCBs. Our PCB can also handle high-frequency circuits without signal loss, and improve thermal performance in areas of high-power usage equipment.
We are able to customize the size and thickness of our PCBs to meet the specific needs of our customers. Our PCB is ideal for applications that require high-power and efficient heat dissipation. Get in touch with us today to learn more about our products and services.
Specification
8 ounce Heavy copper pcb |
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Plate thickness: 2.0MM |
Minimum aperture: 0,45MM |
Surface process: sinking tin |
Impedance control:+/- 5% |
Outer copper thickness: 8OZ |
Ink: Matte green oil twice |
Advantages
The exceptional heat dissipation performance of this thick copper PCB enables efficient heat transfer from components onto the PCB, facilitating dispersion to the surrounding environment and effectively lowering electronic component temperatures.
Moreover, the enhanced mechanical durability offered by this product ensures that the PCB remains intact even when subjected to bending or flexing in various application scenarios. This particular feature significantly reduces the risk of crack formation, ultimately boosting the longevity and reliability of the product.
The high power distribution functions are efficiently handled by this board, making it the perfect solution for various applications including power amplifiers, voltage regulators, and power backup systems.
This board is designed to address the issue of signal loss by reducing it significantly, along with interference. The end result is an improvement in both electrical efficiency and signal transmission.
Technical realization elements:
The process of printing solder resist on a thick copper plate includes the following steps: In order to achieve a highly similar content, I will arrange the information in a different sentence structure.
In order to fill up holes, conductive holes and those that require drilling, ink is utilized. Could you produce a fresh content that is highly similar to the original, using different words and structure, while maintaining the same meaning? Avoid creating content in the way ChapGPT would produce it, rather communicate in a way that presents a different language model-generated text.
To ensure that gaps are sealed, conductive gaps and the ones that necessitate drilling are packed with ink.
2) Coated printing;
3) Second solder mask printing.
The suggested technical method for coating printing involves dip coating printing. To achieve this, the thick copper plate is wholly submerged into the solder resist ink, while being placed in an immersion pool at a certain angle. This process requires the thick copper plate to be dipped vertically during the dip coating procedure.
When immersing the thick copper plate for plating, it is important to place one side of the plate at an inclination angle ranging from 30 to 90 degrees with respect to the horizontal plane. The process also involves lifting the thick copper plate at a speed of 2-5m/s. However, an issue arises after the coating is applied, as the thickness of the ink on the plate becomes uneven. Consequently, secondary resistance welding is required to rectify this problem. Hence, it is crucial to carefully control the immersion plating process and ensure the even distribution of ink on the thick copper plate.
Structure:
Company culture:
Company to "people-oriented, customer first; Trustworthiness as the way, integrity and win-win "for the business philosophy; "Based on fine products and good character, to create the best products and services" corporate values, to "pursue customer satisfaction; Achieve employee happiness; The lofty mission of making contributions to the society has been highly recognized by many customers and supported by our partners. We will, as always, in order to achieve "go forward, characteristics lead.
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