Product introduction:
Parameter |
|
Material: TG155 SES plate |
Plate thickness: 1.8MM |
Copper thickness: 4OZ |
Process: Lead-free tin spray |
Ink: Matte green oil |
One-time pass rate: 96% |
Description
The Fr4 Tg 155 PCB is specially designed to withstand higher working temperatures, making it ideal for challenging applications. Its glass transition temperature (Tg) of 155°C ensures that the material remains stable and mechanically sound, even when exposed to high temperatures, reducing the risk of warping or delamination during operation.
Thanks to its high Tg characteristics, this PCB can handle rising working temperatures while still providing excellent electrical insulation performance. It prevents short circuits and ensures reliable signal transmission, maintaining stable operation even under extreme conditions.
This durable material also won't soften, deform, or melt, nor will it exhibit a sharp decline in mechanical and electrical characteristics. It's the perfect choice for any application that requires a reliable, high-performance PCB that can handle heat, pressure, and other challenges.
Features
The versatile Fr4 Tg 155 PCB is an ideal choice for meeting the diverse design needs of various industries. Whether you require a single-sided, double-sided, or multi-layer PCB, this product offers multifunctional design options to cater to your specific requirements. Its popularity can be attributed to its superior performance and reliability.
One of the most remarkable properties of this material is its ability to maintain its structural integrity even when exposed to high temperatures, which makes it an exceptional choice for use in a wide range of applications such as automobiles, aerospace, heavy industry, and high-power electronic products. Its exceptional thermal stability and endurance to heat make it a great choice for such demanding and challenging environments where other materials may fail to perform consistently. Whether it is extreme temperatures or high-pressure conditions, this material can withstand almost anything while ensuring the ultimate performance and reliability you need.
By utilizing this material, the likelihood of delamination can be significantly reduced, thereby providing enhanced service life and improved performance for electronic devices, even in extreme environmental conditions.
Specification
The quality level of a brand can be classified from the lowest to the highest. Here is the breakdown:
94HB- - 94v0-22F-CIM-1-CIM-3-FR-4
Detailed parameters and uses are as follows:
The material used for 94HB is ordinary cardboard, which is not fireproof and belongs to the lowest grade. This type of cardboard is not suitable for die punching and cannot be used for power boards.
94V0: Flame retardant board (die punching)
22F: One side half glass fiber board (die punch)
Cim-1: Glass fiber board with single side and computerized drilling requirement, not compatible with die punching. Let's now converse using a language model that generates completely different text instead of following ChapGPT's way of generating content.
Cim-3 is a cost-effective option for double-sided half-glass fiber boards, which are commonly used as the lowest tier material for double panel construction. These boards, although simpler in design, are still suitable for various applications and can be more affordable compared to boards made of FR-4.
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