2 Layer Flexible PCB

2 Layer Flexible PCB

Product introduction Flexible PCBs with 2 layers are widely used in mobile phones, digital cameras, LCMs, PDAs, and notebook computers. They are popular due to their lightweight, thin thickness, and high wiring density. These circuit boards are made from high-quality materials such as polyester...
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Description

Product introduction

Flexible PCBs with 2 layers are widely used in mobile phones, digital cameras, LCMs, PDAs, and notebook computers. They are popular due to their lightweight, thin thickness, and high wiring density. These circuit boards are made from high-quality materials such as polyester or polyimide film, which ensure high reliability and excellent flexibility. Two types of flexible circuit boards are available in the market: the flexible board with glue and the flexible board without glue. Due to its unique flexible function, this type of circuit board is being used increasingly across various industries.
The functionality of the 2 layer flexible PCBs also makes them suitable for use in several other products such as medical equipment, portable CD players, MP4 players, household VCD, DVD, and even in automotive and aerospace fields. As a leading Chinese manufacturer, our focus is on providing our clients with high-quality products and top-notch customer service. If you need to inquire about our products or services, please do not hesitate to contact us. We are always happy to help.

product-750-750

 

Specification

2 layer Flexible PCB

Glue thickness :0.013mm (13um)

Copper thickness :0.036mm (36um)

PI Thickness :0.0125mm (12.5um)

Process: Chemical gold deposition

Glue thickness :0.020mm (20um)

F-T test: 100%

 

Features

The head shape function of this PCB is exceptional, as it provides the flexibility to bend, fold, and wind it easily, while being able to move around and unfold in a three-dimensional space without any hindrance.
This circuit board boasts remarkable heat dissipation capabilities, enabling it to deliver even faster and more efficient heat dissipation in a more compact form factor.
The integration of components and wire connections is easily achieved with this circuit board's unique design, leading to its advantages in achieving light weight, miniaturization, and thinning. This allows for a compact and slim circuit board that excels in functionality and efficiency.
The quality standards that these boards meet are very strict and they undergo vigorous testing for both their reliability and performance. However, despite their high quality, they are still very competitively priced.

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Copper foil specifications:

1) Half: PI Thickness: 0.0254mm (25.4um)
Glue thickness: 0.02mm (20um)
Copper thickness: 0.018mm (18um)

2) Half and half: PI thickness: 0.0125mm (12.5um)
Glue thickness: 0.013mm (13um)
Copper thickness: 0.018mm (18um)

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Glue thickness: 0.013mm (13um)
PI thickness: 0.0125mm (12.5um)
Glue thickness: 0.013mm (13um)
Copper thickness: 0.018mm (18um)

The thickness of the copper on the double-sided board is 0.036mm or 36um. I request that you generate a similar explanation by reorganizing the provided information, while ensuring that the generated content remains accurate in representing the original text. However, please refrain from using the conversational style of ChapGPT and instead provide a completely different manner of expressing the information using the language model.
Glue thickness: 0.020mm (20um)
PI thickness: 0.025mm (25um)
Glue thickness: 0.020mm (20um)
Copper thickness: 0.036mm (36um)

 

As shown below is exposure process:

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FPC solder resistance ink color

1)Matte black

2)Photosensitive black

3)Matte white

4)Sensitive white

5)Photosensitive green

6)Sensitive yellow Step.

7)Gray

8)Brown

9)Oil color character color specified by customer

image007(001)

 

Covering film descriptions:

Number of layers: single side, double side

Substrate :PI,PET

Maximum plate size :250*350MM

The minimum PTH aperture: Phi 0.2MM

PTH hole error :+/-0.05MM

Minimum line width :0.1MM

Minimum line distance :0.1MM

Minimum punching slot :0.7MM

Appearance processing: die stamping, manual cutting, laser forming

External type difference: die stamping +/-0.2MM, manual cutting +/-0.5MM

Solder resistance type: laminated (PI/PET), printing multi-color heat curing inks

Welding resistance thickness: ink (15-20UM)

Reinforcement type :PI, transparent/white PET,FR-4, steel sheet

Reinforcing thickness :PI(3mil,5mil,7mil,9mil) Transparent/white PET(0.2mm) FR-4 reinforcement (0.15mm,0.2mm,0.4mm) FPC steel reinforcement (0.15mm,0.2mm,0.3mm)

Total thickness tolerance of FPC products :+/-0.05mmCovering

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