FPC, or Flexible Printed Circuit board, is a remarkable and reliable electronic component made of a polyester or polyimide film. This circuit board is renowned for its outstanding features, including exceptional flexibility, lightweight, thinness, and high wiring density, making it perfect for applications that require bending.
Flexible Printed Circuit (FPC), also referred to as flexible circuit board and flexible PCB, is a highly sought-after circuit board in the electronics industry due to its lightweight nature, thin profile, and ability to bend and fold easily. However, in China, the inspection of FPC's quality primarily relies on manual visual inspection, which is not only costly but also lacks efficiency. As the electronic industry continues to progress, circuit board designs are becoming more precise and dense, rendering traditional manual detection methods inadequate. Consequently, there is an inevitable need to automate the detection of FPC defects, which has become a driving factor towards industrial advancement. [1].
Flexible circuit (FPC) is a groundbreaking technological advancement pioneered by the United States during the 1970s, specifically for the development of space rocket technology. The core concept revolves around a highly reliable and flexible printed circuit that utilizes either polyester film or polyimide as its base material. Through the utilization of precise circuit designs on thin plastic sheets, an extensive array of intricate components can be embedded within narrow and constrained spaces, forming these remarkable flexible circuits. The intrinsic nature of these circuits allows for unparalleled freedom of bending, folding, and manipulation. Additionally, they possess traits such as lightness in weight, compactness in size, excellent heat dissipation capabilities, and effortless installation procedures, effectively surpassing the limitations of traditional interconnection techniques. The structure of these exceptional circuits primarily emphasizes the use of insulating film, conductor materials, and adhesive substances to ensure their optimal functionality.