Double sided board system
The manufacturing process involves several steps, starting with cutting and then drilling. After that, the boards go through the PTH process and electroplating for better conductivity. Next comes the pretreatment and pasting of dry film, followed by alignment and exposure. Developing and graphic electroplating are done for better circuitry. Film removal and surface treatment come next, followed by the pasting of covering film and pressing. The boards then undergo curing and nickel gold deposition. Printing characters are added, and shearing is done to shape the boards. Electric measurement and punching are carried out for quality control. Finally, the boards go through a final inspection, packaging, and are ready for shipment.
Single panel system
Here's a newly rearranged content based on the original text:
To produce a printed circuit board, the process flow starts with cutting the base material. Then, holes are drilled into it before pasting dry film is applied and aligned. After that, the board undergoes exposure and development, followed by etching. Once the film is removed, surface treatment is done, and the covering film is pasted on. The next step is pressing and curing before the board undergoes surface treatment again. Then, the board undergoes nickel gold deposition and character printing. After that, it's sheared and tested through electric measurement. Lastly, the board is punched, inspected for quality, packed, and shipped.